TMS320DM640 datasheet(18/171 Pages) TI

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Device Characteristics

June 2003 − Revised August 2004

SPRS222C

1.3

Device Characteristics

Table 1−1 provides an overview of the DM641 DSP. The table shows significant features of the DM641 device,

including the capacity of on-chip RAM, the peripherals, the CPU frequency, and the package type with pin

count.

Table 1−1. Characteristics of the DM641 Processor

HARDWARE FEATURES

DM641

EMIFA (32-bit bus width)

(clock source = AECLKIN)

EDMA (64 independent channels)

McASP0 (uses Peripheral Clock [AUXCLK])

Peripherals

I2C0 (uses Peripheral Clock)

Peripherals

HPI (16-bit)

1 (HPI16)

Not all peripherals pins are

available at the same time

McBSPs

(internal clock source = CPU/4 clock frequency)

available at the same time

(For more detail, see the

Device Configuration

Configurable Video Ports (VP0 and VP1)

(For more detail, see the

Device Configuration

section).

10/100 Ethernet MAC (EMAC)

section).

Management Data Input/Output (MDIO)

VCXO Interpolated Control Port (VIC)

32-Bit Timers

(internal clock source = CPU/8 clock frequency)

General-Purpose Input/Output Port (GP0)

Size (Bytes)

160K

On-Chip Memory

Organization

16K-Byte (16KB) L1 Program (L1P) Cache

16KB L1 Data (L1D) Cache

128KB Unified Mapped RAM/Cache (L2)

CPU ID + CPU Rev ID

Control Status Register (CSR.[31:16])

0x0C01

JTAG BSDL_ID

JTAGID register (address location: 0x01B3F008)

0x0007902F

Frequency

MHz

500, 600

Cycle Time

2 ns (DM641-500)

[500-MHz CPU, 100 MHz EMIF†]

1.67 ns (DM641-600)

[600-MHz CPU, 133 MHz EMIF†]

Voltage

Core (V)

1.2 V (-500)

1.4 V (-600)

Voltage

I/O (V)

3.3 V

PLL Options

CLKIN frequency multiplier

Bypass (x1), x6, x12

BGA Package

23 x 23 mm

548-Pin BGA (GDK)

BGA Package

27 x 27 mm

548-Pin BGA (GNZ)

Process Technology

µm

0.13

µm

Product Status‡

Product Preview (PP), Advance Information (AI),

or Production Data (PD)

† On this DM64x device, the rated EMIF speed affects only the SDRAM interface on the EMIF. For more detailed information, see the EMIF device

speed portion of this data sheet.

‡ PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard

warranty. Production processing does not necessarily include testing of all parameters.

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