BM71BLE01FC2 datasheet(31/64 Pages) MICROCHIP

部件名	BM71BLE01FC2

功能描述	Bluetooth짰 Low Energy (BLE) Module

PDF	64 Pages

Scroll/Zoom	100%

制造商	MICROCHIP [Microchip Technology]

网页	http://www.microchip.com

标志

31 / 64 page

 2015-2016 Microchip Technology Inc.

DS60001372D-Page 31

BM70/71

4.3

Host PCB Mounting Suggestion

4.3.1

BM70BLES1FC2 HOST PCB

MOUNTING

Figure 4-5 illustrates the host PCB mounting sugges-

tions for the BM70BLES1FC2 module, and it shows

minimum ground plane area to the left and right of the

module for best antenna performance.

While designing the host PCB, the area under the

antenna should not contain any top, inner, or bottom

copper layer. A low-impedance ground plane ensures

the best radio performance (best range, low noise).

The ground plane can be extended beyond the mini-

mum recommended as required for the host PCB EMC

noise reduction. For best range performance, keep all

external metal away by minimum 30 mm from the

ceramic chip antenna.

FIGURE 4-5:

BM70BLES1FC2 HOST PCB MOUNTING SUGGESTION

BM71BLE01FC2 数据表(PDF) 31 Page - Microchip Technology