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BM71BLE01FC2 数据表(PDF) 5 Page - Microchip Technology

部件名 BM71BLE01FC2
功能描述  Bluetooth짰 Low Energy (BLE) Module
PDF  64 Pages
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制造商  MICROCHIP [Microchip Technology]
网页  http://www.microchip.com
标志 MICROCHIP - Microchip Technology

BM71BLE01FC2 数据表(HTML) 5 Page - Microchip Technology

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 2015-2016 Microchip Technology Inc.
DS60001372D-Page 5
BM70/71
1.0
DEVICE OVERVIEW
The BM70/71 embedded 2.4 GHz Bluetooth version 4.2
BLE module is built around Microchip Technology
IS1870/71 BLE System on Chip (SoC). The IS1870/71
SoC incorporates Bluetooth stack, power management
subsystem, 2.4 GHz transceiver, and RF power ampli-
fier. The user can embed Bluetooth functionality into any
applications using the BM70/71 module.
The BM70/71 enables faster product development and
time to market. It is designed to provide simple Bluetooth
solutions with the following features:
• Simple integration and programming
• Reduced development time
• Superior wireless module with low-cost system
• Interoperability with Apple® iOS and Android™
OS
• Wide range of applications
In addition, the BM70/71 supports Beacon technology
to improve user experiences in IoT applications, such
as auto connection/control and data to cloud.
The BM70/71 can independently maintain a low-power
wireless connection, and the low-power usage and flex-
ible power management maximizes the module’s lifetime
in battery operated devices. Also, wide operating tem-
perature range enables its use in indoor and outdoor
environments.
The BM70/71 is a small, compact, surface mount on the
host PCB with the castellated pads making the interface
easy and reliable. The BM71 is relatively small form fac-
tor module targeted for applications, such as wearable
sports, fitness devices and so on.
1.1
Interface Description
Figure 1-1 and Figure 1-2 illustrate an example of the
BM70/71 module-based system. Figure 1-3 through
Figure 1-6 illustrate the pin diagrams. Table 1-1 provides
pin descriptions.
FIGURE 1-1:
BM70-BASED SYSTEM BLOCK DIAGRAM



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