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BM71BLE01FC2 数据表(PDF) 33 Page - Microchip Technology |
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BM71BLE01FC2 数据表(HTML) 33 Page - Microchip Technology |
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33 / 64 page ![]() 2015-2016 Microchip Technology Inc. DS60001372D-Page 33 BM70/71 4.3.3 BM71BLES1FC2 HOST PCB MOUNTING Figure 4-7 illustrates the mounting suggestions for the BM71BLES1FC2 module. It also shows the area around the antenna required for the best antenna per- formance. The area under the antenna should not contain any top, inner, or bottom copper layer when designing the host PCB. A low-impedance ground plane ensures the best radio performance (best range, low noise). The ground plane can be extended beyond the minimum recom- mended as required for the host PCB EMC noise reduction. For best range performance, keep all exter- nal metal away by minimum 30 mm from the ceramic chip antenna. FIGURE 4-7: BM71BLES1FC2 HOST MOUNTING SUGGESTION |
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