BM71BLE01FC2 datasheet(49/64 Pages) MICROCHIP

部件名	BM71BLE01FC2

功能描述	Bluetooth짰 Low Energy (BLE) Module

PDF	64 Pages

Scroll/Zoom	100%

制造商	MICROCHIP [Microchip Technology]

网页	http://www.microchip.com

标志

49 / 64 page

 2015-2016 Microchip Technology Inc.

DS60001372D-Page 49

BM70/71

7.0

SOLDERING

RECOMMENDATIONS

The BM70/71 should be assembled using a standard

lead-free, re-flow profile IPC/JEDEC J-STD-020. The

module can be soldered to the host PCB using a stan-

dard lead or lead-free solder re-flow profiles, see

Figure 7-1.

To avoid any damage to the BM70/71, follow these rec-

ommendations:

• Do not exceed the peak temperature (TP) of

+250

˚C

• Use no-clean flux solder paste

• Do not wash as moisture can be trapped under

the shield

• Use only one flow. If PCB requires multiple flows,

apply the module on the final flow.

For additional information on solder re-flow recommen-

dations, refer to the “Solder Re-flow Recommendation

Application Note

” (DS00233), which is available for

download

from

the

Microchip

web

site

at:

http://www.microchip.com.

FIGURE 7-1:

RE-FLOW PROFILE

BM71BLE01FC2 数据表(PDF) 49 Page - Microchip Technology

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