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STGAP1AS 数据表(PDF) 68 Page - STMicroelectronics |
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STGAP1AS 数据表(HTML) 68 Page - STMicroelectronics |
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68 / 70 page ![]() Package information STGAP1AS 68/70 DocID029344 Rev 2 Figure 27. SO24W suggested land pattern Table 59. SO24W package mechanical data Symbol Dimensions (mm) Notes Min. Typ. Max. A 2.35 - 2.65 - A1 0.10 - 0.30 - B 0.33 - 0.51 - C 0.23 - 0.32 - D 15.20 - 15.60 (1) 1. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusions or gate burrs shall not exceed 0.15 mm per side. E 7.40 - 7.60 - e - 1.27 - - H 10.00 - 10.65 - h 0.25 - 0.75 - L 0.40 - 1.27 - K 0 - 8 Degrees ddd - - 0.10 - |
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