TNETV2685FIBZUT7 datasheet(183/191 Pages) TI1

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TMS320DM647

TMS320DM648

www.ti.com

SPRS372H – MAY 2007 – REVISED APRIL 2012

Mechanical Data

The following table(s) show the thermal resistance characteristics for the ZUT mechanical package.

7.1

Thermal Data for ZUT

Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZUT]

°C/W(1)

AIR FLOW (m/s)(2)

ΘJC

ΘJC Junction-to-case

1.7

N/A

ΘJB

ΘJB Junction-to-board

8.6

N/A

ΘJA

ΘJA Junction-to-free air

17.2

0.0

13.7

1.0

12.4

2.0

11.5

3.0

ψJT

ψJT Junction-to-package top

0.6

0.0

0.6

1.0

0.6

2.0

0.7

3.0

ψiJB

ψJB Junction-to-board

8.4

0.0

7.4

1.0

7.0

2.0

6.7

3.0

(1)

The junction-to-case measurement was conducted in a JEDEC defined 1S0P system. Other measurements were conducted in a JEDEC

defined 1S2P system and will change based on environment as well as application.

For more information, see these three EIA/JEDEC standards:

•

EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment Conditions - Natural Convection (Still Air)

•

EIA/JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages

•

JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements

(2)

m/s = meters per second

Mechanical Data

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