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STM32F078CB 数据表(PDF) 96 Page - STMicroelectronics |
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STM32F078CB 数据表(HTML) 96 Page - STMicroelectronics |
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96 / 120 page  Package information STM32F078CB, STM32F078RB, STM32F078VB 96/120 DocID026006 Rev 4 7 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. 7.1 UFBGA100 package information UFBGA100 is a 100-ball, 7 x 7 mm, 0.50 mm pitch, ultra-fine-profile ball grid array package. Figure 34. UFBGA100 package outline 1. Drawing is not to scale. Table 69. UFBGA100 package mechanical data Symbol millimeters inches(1) Min. Typ. Max. Min. Typ. Max. A - - 0.600 - - 0.0236 A1 - - 0.110 - - 0.0043 A2 - 0.450 - - 0.0177 - A3 - 0.130 - - 0.0051 0.0094 A4 - 0.320 - - 0.0126 - |
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