STM32F078CB datasheet(97/120 Pages) STMICROELECTRONICS

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DocID026006 Rev 4

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STM32F078CB, STM32F078RB, STM32F078VB

Package information

117

Figure 35. Recommended footprint for UFBGA100 package

0.240

0.290

0.340

0.0094

0.0114

0.0134

6.850

7.000

7.150

0.2697

0.2756

0.2815

5.500

0.2165

6.850

7.000

7.150

0.2697

0.2756

0.2815

5.500

0.2165

0.500

0.0197

0.750

0.0295

ddd

0.080

0.0031

eee

0.150

0.0059

fff

0.050

0.0020

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Table 70. UFBGA100 recommended PCB design rules

Dimension

Recommended values

Pitch

0.5

Dpad

0.280 mm

Dsm

0.370 mm typ. (depends on the solder mask

registration tolerance)

Stencil opening

0.280 mm

Stencil thickness

Between 0.100 mm and 0.125 mm

Table 69. UFBGA100 package mechanical data (continued)

Symbol

millimeters

inches(1)

Min.

Typ.

Max.

Min.

Typ.

Max.

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