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STM32F769AI 数据表(PDF) 249 Page - STMicroelectronics |
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STM32F769AI 数据表(HTML) 249 Page - STMicroelectronics |
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249 / 255 page  DocID029041 Rev 4 249/255 STM32F765xx STM32F767xx STM32F768Ax STM32F769xx Package information 254 Figure 102. TFBGA216, 13 x 13 mm, 0.8 mm pitch, thin fine-pitch ball grid array package recommended footprint G - 0.900 - - 0.0354 - ddd - - 0.100 - - 0.0039 eee - - 0.150 - - 0.0059 fff - - 0.080 - - 0.0031 1. Values in inches are converted from mm and rounded to 4 decimal digits. Table 134. TFBGA216 recommended PCB design rules (0.8 mm pitch BGA) Dimension Recommended values Pitch 0.8 Dpad 0.400 mm Dsm 0.470 mm typ. (depends on the soldermask reg- istration tolerance) Stencil opening 0.400 mm Stencil thickness Between 0.100 mm and 0.125 mm Pad trace width 0.120 mm Table 133. TFBGA216, 13 × 13 × 0.8 mm thin fine-pitch ball grid array package mechanical data (continued) Symbol millimeters inches(1) Min Typ Max Min Typ Max |
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