STM32F769AI datasheet(246/255 Pages) STMICROELECTRONICS

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STM32F769AI 数据表(PDF) 246 Page - STMicroelectronics

部件名	STM32F769AI

功能描述	Dual mode Quad-SPI

PDF	255 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

246 / 255 page

Package information

STM32F765xx STM32F767xx STM32F768Ax STM32F769xx

246/255

DocID029041 Rev 4

Figure 99. UFBGA176+25, 10 x 10 mm x 0.65 mm, ultra fine-pitch ball grid array

package recommended footprint

Table 132. UFBGA176+25 recommended PCB design rules (0.65 mm pitch BGA)

Dimension

Recommended values

Pitch

0.65 mm

Dpad

0.300 mm

Dsm

0.400 mm typ. (depends on the soldermask reg-

istration tolerance)

Stencil opening

0.300 mm

Stencil thickness

Between 0.100 mm and 0.125 mm

Pad trace width

0.100 mm

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