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STM32F769AI 数据表(PDF) 244 Page - STMicroelectronics |
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STM32F769AI 数据表(HTML) 244 Page - STMicroelectronics |
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244 / 255 page  Package information STM32F765xx STM32F767xx STM32F768Ax STM32F769xx 244/255 DocID029041 Rev 4 WLCSP180 device marking The following figure gives an example of topside marking orientation versus ball A1 identifier location. Other optional marking or inset/upset marks, which identify the parts throughout supply chain operations, are not indicated below. Figure 97. WLCSP180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale package top view example 1. Parts marked as “ES”, “E” or accompanied by an Engineering Sample notification letter, are not yet qualified and therefore not yet ready to be used in production and any consequences deriving from such usage will not be at ST charge. In no event, ST will be liable for any customer usage of these engineering samples in production. ST Quality has to be contacted prior to any decision to use these Engineering samples to run qualification activity. |
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