STM32F769AI datasheet(242/255 Pages) STMICROELECTRONICS

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STM32F765xx STM32F767xx STM32F768Ax STM32F769xx

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DocID029041 Rev 4

Table 129. WLCSP 180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale

package mechanical data

Symbol

millimeters

inches(1)

1. Values in inches are converted from mm and rounded to 4 decimal digits.

Min

Typ

Max

Min

Typ

Max

0.525

0.555

0.585

0.0207

0.0219

0.230

0.175

0.0069

0.380

0.0150

0.025

0.0010

b(2)

2. Dimension is measured at the maximum bump diameter parallel to primary datum Z.

0.220

0.250

0.280

0.0087

0.0098

0.0110

5.502

5.537

5.572

0.2166

0.2180

0.2194

6.060

6.095

6.130

0.2386

0.2400

0.2413

0.400

0.0157

4.800

0.1890

5.200

0.2047

0.368

0.0145

0.477

0.0188

aaa

0.110

0.0043

bbb

0.110

0.0043

ccc

0.110

0.0043

ddd

0.050

0.0020

eee

0.050

0.0020

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