STM32F769AI datasheet(243/255 Pages) STMICROELECTRONICS

数据搜索系统，热门电子元器件搜索

STM32F769AI 数据表(PDF) 243 Page - STMicroelectronics

部件名	STM32F769AI

功能描述	Dual mode Quad-SPI

PDF	255 Pages

Scroll/Zoom	100%

制造商	STMICROELECTRONICS [STMicroelectronics]

网页	http://www.st.com

标志

243 / 255 page

DocID029041 Rev 4

243/255

STM32F765xx STM32F767xx STM32F768Ax STM32F769xx

Package information

254

Figure 96. WLCSP 180-bump, 5.5 x 6 mm, 0.4 mm pitch wafer level chip scale

package recommended footprint

1. Dimensions are expressed in millimeters.

Table 130. WLCSP 180-bump, 5.5 x 6 mm, recommended PCB design rules

(0.4 mm pitch)

Dimension

Recommended values

Pitch

0.4

Dpad

0.225 mm

Dsm

0.290 mm typ. (depends on the soldermask

registration tolerance)

Stencil opening

0.250 mm

Stencil thickness

0.1 mm

ALLDATASHEET是否为您带来帮助? [ DONATE ]
关于 Alldatasheet \| 广告服务 \| 联系我们 \| 隐私政策 \| 数据表链接 \| 链接交换 \| 制造商名单 All Rights Reserved©Alldatasheet.com
Mirror Sites English : Alldatasheet.com \| English : Alldatasheet.net \| Chinese : Alldatasheetcn.com \| German : Alldatasheetde.com \| Japanese : Alldatasheet.jp Russian : Alldatasheetru.com \| Korean : Alldatasheet.co.kr \| Spanish : Alldatasheet.es \| French : Alldatasheet.fr \| Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com \| Polish : Alldatasheet.pl \| Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in \| Mexican : Alldatasheet.com.mx \| British : Alldatasheet.co.uk \| New Zealand : Alldatasheet.co.nz
Family Site : ic2ic.com \| icmetro.com

ALLDATASHEET是否为您带来帮助? [ DONATE ]

Family Site : ic2ic.com | icmetro.com