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80960JD 数据表(PDF) 25 Page - Intel Corporation

部件名 80960JD
功能描述  3.3 V EMBEDDED 32-BIT MICROPROCESSOR
PDF  59 Pages
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制造商  INTEL [Intel Corporation]
网页  http://www.intel.com
标志 INTEL - Intel Corporation

80960JD 数据表(HTML) 25 Page - Intel Corporation

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PRODUCT PREVIEW
19
80960JD
3.2
Package Thermal Specifications
The 80960JD is specified for operation when TC
(case temperature) is within the range of 0°C to
100°C for both PGA and PQFP packages. Case
temperature may be measured in any environment
to determine whether the 80960JD is within its
specified operating range. The case temperature
should be measured at the center of the top surface,
opposite the pins.
θ
CA is the thermal resistance from case to ambient.
Use the following equation to calculate TA, the
maximum ambient temperature to conform to a
particular case temperature:
TA = TC - P (θCA)
Junction temperature (TJ) is commonly used in
reliability calculations. TJ can be calculated from θJC
(thermal resistance from junction to case) using the
following equation:
TJ = TC + P (θJC)
Similarly, if TA is known, the corresponding case
temperature (TC) can be calculated as follows:
TC = TA + P (θCA)
Compute P by multiplying ICC from Table 14 and
VCC. Values for θJC and θCA are given in Table 10
for the PGA package and Table 11 for the PQFP
package. For high speed operation, the processor’s
θ
JA
may be significantly reduced by adding a
heatsink and/or by increasing airflow.
Table 12 shows the maximum ambient temperature
(TA) permitted without exceeding TC for both PGA
and PQFP packages. The values are based on
typical ICC and VCC of +3.3 V, with a TCASE of
+100°C.
Table 10. 132-Lead PGA Package Thermal Characteristics
Thermal Resistance — °C/Watt
Parameter
Airflow — ft./min (m/sec)
0
(0)
200
(1.01)
400
(2.03)
600
(3.04)
800
(4.06)
1000
(5.08)
θ
JC (Junction-to-Case)
0.7
0.7
0.7
0.7
0.7
0.7
θ
CA (Case-to-Ambient) (No Heatsink)
25
19
14
12
11
10
θ
CA (Case-to-Ambient) (Omnidirectional Heatsink)
15
96544
θ
CA (Case-to-Ambient) (Unidirectional Heatsink)
16
86544
NOTES:
1. This table applies to a PGA device plugged into a socket or soldered directly into a board.
2.
θJA = θJC + θCA
3.
θ
J-CAP = 5.6°C/W (approx.) (no heatsink)
4.
θJ-PIN = 6.4°C/W (inner pins) (approx.) (no heatsink)
5.
θ
J-PIN = 6.2°C/W (outer pins) (approx.) (no heatsink)
6.
θ
J-CAP = 3°C/W (approx.) (with heatsink)
7.
θJ-PIN = 3.3°C/W (inner pins) (approx.) (with heatsink)
8.
θ
J-PIN = 3.3°C/W (outer pins) (approx.) (with heatsink)
θ
JC
θ
JA
θ
J-CAP
θ
CA
θ
J-PIN



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