AD5424 datasheet(5/24 Pages) AD

5 / 24 page

REV. 0

AD5424/AD5433/AD5445

–5–

ABSOLUTE MAXIMUM RATINGS

(TA = 25 C, unless otherwise noted.)

VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

VREF, RFB to GND . . . . . . . . . . . . . . . . . . . . . . –12 V to +12 V

IOUT1, IOUT2 to GND . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V

Logic Inputs and Output

. . . . . . . . . . . –0.3 V to VDD +0.3 V

Operating Temperature Range

Extended Industrial (Y Version) . . . . . . . . –40 C to +125 C

Storage Temperature Range . . . . . . . . . . . . . –65 C to +150 C

Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150 C

16-Lead TSSOP JA Thermal Impedance . . . . . . . . . 150 C/W

20-Lead TSSOP JA Thermal Impedance . . . . . . . . . 143 C/W

20-Lead LFCSP JA Thermal Impedance . . . . . . . . . 135 C/W

Lead Temperature, Soldering (10 seconds) . . . . . . . . . . 300 C

IR Reflow, Peak Temperature (<20 seconds) . . . . . . . . 235 C

NOTES

1 Stresses above those listed under Absolute Maximum Ratings may cause perma-

nent damage to the device. This is a stress rating only and functional operation of

the device at these or any other conditions above those listed in the operational

sections of this specification is not implied. Exposure to absolute maximum rating

conditions for extended periods may affect device reliability. Only one absolute

maximum rating may be applied at any one time.

2 Overvoltages at DBx,

CS, and R/W, will be clamped by internal diodes.

IOL

200 A

IOH

200 A

50pF

OUTPUT

VOH (MIN) + VOL (MAX)

Figure 2. Load Circuit for Data Output Timing Specifications

ORDERING GUIDE

Resolution INL

Temperature

Package

Model

(Bits)

(LSB)

Range

Package Description

Option

AD5424YRU

±0.25

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-16

AD5424YRU-REEL

±0.25

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5424YRU-REEL7

±0.25

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5424YCP

±0.25

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5424YCP-REEL

±0.25

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5424YCP-REEL7

±0.25

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5433YRU

±0.5

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5433YRU-REEL

±0.5

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5433YRU-REEL7

±0.5

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5433YCP

±0.5

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5433YCP-REEL

±0.5

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5433YCP-REEL7

±0.5

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5445YRU

±1

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5445YRU-REEL

±1

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5445YRU-REEL7

±1

–40 C to +125 CTSSOP (Thin Shrink Small Outline Package)

RU-20

AD5445YCP

±1

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5445YCP-REEL

±1

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

AD5445YCP-REEL7

±1

–40 C to +125 C

LFCSP (Chip Scale Package)

CP-20

EVAL-AD5424EB

Evaluation Kit

EVAL-AD5433EB

Evaluation Kit

EVAL-AD5445EB

Evaluation Kit

CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily

accumulate on the human body and test equipment and can discharge without detection. Although the

AD5424/AD5433/AD5445 features proprietary ESD protection circuitry, permanent damage may

occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD precautions

are recommended to avoid performance degradation or loss of functionality.

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