GD25S512MDBJS datasheet(2/87 Pages) GIGADEVICE

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3.3V Uniform Sector

Dual and Quad Serial Flash

GD25S512MD

Contents

FEATURES ................................................................................................................................................................ 4

GENERAL DESCRIPTION...................................................................................................................................... 5

MEMORY ORGANIZATION .................................................................................................................................... 9

DEVICE OPERATION ............................................................................................................................................ 10

4.1.

STACKED DIE OPERATIONS ................................................................................................................................ 10

4.2.

SPI MODE .......................................................................................................................................................... 11

DATA PROTECTION .............................................................................................................................................. 12

REGISTERS ............................................................................................................................................................ 13

6.1.

STATUS REGISTERS ............................................................................................................................................ 13

6.2.

EXTENDED ADDRESS REGISTER ......................................................................................................................... 17

COMMANDS DESCRIPTION ............................................................................................................................... 18

7.1.

SOFTWARE DIE SELECT (C2H) ........................................................................................................................... 23

7.2.

READ ACTIVE DIE ID# (F8H)............................................................................................................................. 23

7.3.

WRITE ENABLE (WREN) (06H) ......................................................................................................................... 24

7.4.

WRITE DISABLE (WRDI) (04H) ......................................................................................................................... 24

7.5.

WRITE ENABLE FOR VOLATILE STATUS REGISTER (50H) .................................................................................. 25

7.6.

READ STATUS REGISTER (RDSR) (05H OR 35H OR 15H) .................................................................................. 25

7.7.

WRITE STATUS REGISTER (WRSR) (01H OR 31H OR 11H)................................................................................ 26

7.8.

READ EXTENDED REGISTER (C8H) .................................................................................................................... 26

7.9.

WRITE EXTENDED REGISTER (C5H)................................................................................................................... 27

7.10.

READ DATA BYTES (READ 03H OR 4READ 13H) ............................................................................................ 27

7.11.

READ DATA BYTES AT HIGHER SPEED (FAST READ 0BH OR 4FAST READ 0CH)............................................... 28

7.12.

DUAL OUTPUT FAST READ (DOFR 3BH OR 4DOFR 3CH)................................................................................ 30

7.13.

QUAD OUTPUT FAST READ (QOFR 6BH OR 4QOFR 6CH) ............................................................................... 32

7.14.

DUAL I/O FAST READ (DIOFR BBH OR 4DIOFR BCH) ................................................................................... 35

7.15.

QUAD I/O FAST READ (QIOFR EBH OR 4QIOFR ECH) ................................................................................... 36

7.16.

SET BURST WITH WRAP (77H) ........................................................................................................................... 38

7.17.

PAGE PROGRAM (PP 02H OR 4PP 12H).............................................................................................................. 39

7.18.

QUAD PAGE PROGRAM (QPP 32H OR 4QPP 34H).............................................................................................. 41

7.19.

SECTOR ERASE (SE 20H OR 4SE 21H) ............................................................................................................... 44

7.20.

32KB BLOCK ERASE (BE32 52H OR 4BE32 5CH)............................................................................................. 45

7.21.

64KB BLOCK ERASE (BE64 D8H OR 4BE64 DCH) ........................................................................................... 46

7.22.

CHIP ERASE (CE) (60/C7H) ............................................................................................................................... 47

7.23.

DEEP POWER-DOWN (DP) (B9H) ....................................................................................................................... 47

7.24.

READ UNIQUE ID (4BH) .................................................................................................................................... 48

7.25.

ENTER 4-BYTE ADDRESS MODE (B7H).............................................................................................................. 49

7.26.

EXIT 4-BYTE ADDRESS MODE (E9H) ................................................................................................................. 49

7.27.

CLEAR SR FLAGS (30H) ..................................................................................................................................... 50

7.28.

RELEASE FROM DEEP POWER-DOWN AND READ DEVICE ID (RDI) (ABH)........................................................ 50

GD25S512MDBJS 数据表(PDF) 2 Page - GigaDevice Semiconductor (Beijing) Inc.

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