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GD25S512MDBJS 数据表(PDF) 10 Page - GigaDevice Semiconductor (Beijing) Inc.

部件名 GD25S512MDBJS
功能描述  3.3V Uniform Sector Dual and Quad Serial Flash
PDF  87 Pages
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制造商  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
网页  http://www.gigadevice.com/
标志 GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD25S512MDBJS 数据表(HTML) 10 Page - GigaDevice Semiconductor (Beijing) Inc.

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3.3V Uniform Sector
Dual and Quad Serial Flash
GD25S512MD
10
4.
DEVICE OPERATION
4.1. Stacked Die Operations
Once the device is power on, Die #0 will be active and have control of SPI bus. “Software Die Select (C2H)” instruction
followed by the 8-bit Die ID can be used to select the active die. The active die is available to accept any instruction issued
by the controller and perform specific operations. The inactive/idle die does not accept any other instruction except the
“Software Die Select (C2H)” and “Software Reset (66H+99H)”. However, the inactive/idle die can still perform internal
Program/Erase
operation which was initiated when the die was active. Therefore, “Read (on Active die) while Program/Erase
(on Idle die)” and “Multi–die Program/Erase (both Active & Idle dies)” concurrent operations are feasible in the stack die
configuration. “Software Die Select (C2H)” instruction will only change the active / idle status of the stacked dies, and it will
not interrupt any on-going Program/Erase operations.
“0”
“1”
B7H
E9H
Die #1
4-Byte
Address
3-Byte
Address
SPI
Dual SPI
Quad SPI
SPI
Dual SPI
Quad SPI
ID = #1
ADP=?
“0”
“1”
B7H
E9H
Die #0
4-Byte
Address
3-Byte
Address
SPI
Dual SPI
Quad SPI
SPI
Dual SPI
Quad SPI
ADP=?
(default active after power is up)
ID = #0
Software
Die Select (C2H)
Device Initialization
& Status Register Refresh
(Non-Volatile Cells)
Power Up
Note: ADP bit in the Status Register is only used to determine 3-Byte or 4-Byte address modes during
power up. Changing ADP bit value will not switch the address modes during normal operation.



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