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GD25S512MDBJS 数据表(PDF) 5 Page - GigaDevice Semiconductor (Beijing) Inc.

部件名 GD25S512MDBJS
功能描述  3.3V Uniform Sector Dual and Quad Serial Flash
PDF  87 Pages
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制造商  GIGADEVICE [GigaDevice Semiconductor (Beijing) Inc.]
网页  http://www.gigadevice.com/
标志 GIGADEVICE - GigaDevice Semiconductor (Beijing) Inc.

GD25S512MDBJS 数据表(HTML) 5 Page - GigaDevice Semiconductor (Beijing) Inc.

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3.3V Uniform Sector
Dual and Quad Serial Flash
GD25S512MD
5
2. GENERAL DESCRIPTION
The GD25S512MD (2 x 256M-bit) Serial MCP (Multi Chip Package) Flash memory is based on the popular GD25B
series by stacking two individual GD25B256D dies into a standard 8-pin package. It offers the highest memory density
for the low pin-count package, as well as Concurrent Operations in Serial Flash memory for applications that demand
high Program/Erase data throughput.
The GD25S512MD Serial flash supports the standard Serial Peripheral Interface (SPI), and the Dual/Quad SPI:
Serial Clock, Chip Select, Serial Data I/O0 (SI), I/O1 (SO), I/O2, and I/O3. The Dual SPI data is transferred with speed of
208Mbit/s and the Quad SPI data is transferred with speed of 416Mbit/s.
CONNECTION DIAGRAM
Figure 1 Connection Diagram
Note:
1.
Only for special order, Pin 3 of 16-LEAD SOP package or Pin A4 of 24-BALL TFBGA (5x5 ball array) package is
RESET# pin. Please contact GigaDevice for detail.
2.
CS# must be driven high if chip is not selected. Please don’t leave CS# floating any time after power is on.
CS#
SO
(IO1)
IO2
VSS
Top View
VCC
IO3
SCLK
SI
(IO0)
8–LEAD WSON
1
2
3
4
5
6
7
8
Top View
A2
A3
A4
A5
B2
B3
B4
B5
B1
C1
C2
C3
C4
C5
D1
D2
D3
D4
D5
E1
E2
E3
E4
E5
NC
NC
NC
NC
NC
IO3
NC
IO2
VCC
NC
(1)
SI(IO0)
NC
NC
VSS
NC
SO(IO1)
NC
CS#
SCLK
NC
NC
NC
NC
NC
24-BALL TFBGA (5x5 ball array)
CS#
SO
(IO1)
IO2
VSS
Top View
VCC
IO3
SCLK
SI
(IO0)
16-LEAD SOP
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
NC
(1)
NC
NC
NC
NC
NC
NC
NC



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