PCF8811USLASH2DASLASH1 datasheet(70/73 Pages) PHILIPS

70 / 73 page

2004 May 17

Philips Semiconductors

Product speciﬁcation

× 128 pixels matrix LCD driver

PCF8811

26 TRAY INFORMATION

handbook, full pagewidth

MGU295

1,1

x,1

2,1

1,2

1,3

1,y

x,y

2,2

3,1

Fig.55 Tray details.

Table 30 Tray dimensions

handbook, halfpage

MGW771

PCF8811-1

Fig.56 Tray alignment.

The orientation of the IC in a pocket is indicated by the position of

the IC type name on the die surface with respect to the chamfer on

the upper left corner of the tray. Refer to the bonding pad location

diagram for the orientation and position of the type name on the die

surface.

DIM.

DESCRIPTION

VALUE

pocket pitch; x direction

13.77 mm

pocket pitch; y direction

4.45 mm

pocket width; x direction

12.55 mm

pocket width; y direction

2.41 mm

tray width; x direction

50.80 mm

tray width; y direction

50.80 mm

number of pockets in

x direction

number of pockets in

y direction

PCF8811U/2DA/1 数据表(PDF) 70 Page - NXP Semiconductors

PCF8811U/2DA/1 数据表(HTML) 70 Page - NXP Semiconductors

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73

数据表下载