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IIS2DLPC 数据表(PDF) 66 Page - STMicroelectronics |
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IIS2DLPC 数据表(HTML) 66 Page - STMicroelectronics |
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66 / 69 page ![]() Package information IIS2DLPC 66/69 DocID031788 Rev 4 9 Package information In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark. 9.1 Soldering information The LGA package is compliant with the ECOPACK, RoHS and “Green” standard. It is qualified for soldering heat resistance according to JEDEC J-STD-020. Land pattern and soldering recommendations are available at www.st.com. 9.2 LGA-12 package information Figure 21. LGA-12 2.0 x 2.0 x 0.7 mm package outline and mechanical data |
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