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IIS2DLPC 数据表(PDF) 7 Page - STMicroelectronics

部件名 IIS2DLPC
功能描述  MEMS digital output motion sensor: high-performance ultra-low-power 3-axis accelerometer for industrial applications
PDF  69 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

IIS2DLPC 数据表(HTML) 7 Page - STMicroelectronics

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IIS2DLPC
List of figures
69
List of figures
Figure 1.
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 2.
Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Figure 3.
SPI slave timing diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Figure 4.
I2C slave timing diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 5.
Single data conversion on demand functionality. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Figure 6.
IIS2DLPC electrical connections (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Figure 7.
Accelerometer chain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Figure 8.
Frequency response - high-performance mode
(ODR = 1600 Hz, BW = 400 Hz, output of LPF1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Figure 9.
Frequency response - high-performance mode
a) ODR 800 Hz, BW = 400 Hz, output of LPF1
b) ODR 800 Hz, BW = 200 Hz, output of LPF2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Figure 10.
Frequency response - low-power mode 4 (LPM4)
a) ODR 200 Hz, BW = 180 Hz, Output of LPF1
b) ODR 200 Hz, BW = 50 Hz, Output of LPF2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Figure 11.
Continuous-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 12.
Trigger event to FIFO for Continuous-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Figure 13.
Bypass-to-Continuous mode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 14.
Trigger event to FIFO for Bypass-to-Continuous mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
Figure 15.
Read and write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Figure 16.
SPI read protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 17.
Multiple byte SPI read protocol (2-byte example) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
Figure 18.
SPI write protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 19.
Multiple byte SPI write protocol (2-byte example). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Figure 20.
SPI read protocol in 3-wire mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Figure 21.
LGA-12 2.0 x 2.0 x 0.7 mm package outline and mechanical data. . . . . . . . . . . . . . . . . . . 66
Figure 22.
Carrier tape information for LGA-12 package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Figure 23.
LGA-12 package orientation in carrier tape . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67



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