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MPF5024AMBA0ES 数据表(PDF) 2 Page - NXP Semiconductors |
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MPF5024AMBA0ES 数据表(HTML) 2 Page - NXP Semiconductors |
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2 / 93 page ![]() NXP Semiconductors PF5024 Power management integrated circuit (PMIC) for high performance applications PF5024 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2020. All rights reserved. Product data sheet Rev. 1 — 15 April 2020 2 / 93 3 Simplified application diagram 4 aaa-030040 V1P5D VIN V1P5A SW1FB SW1LX SW2FB SW2LX SW3FB SW3LX SW4FB SW4LX PGOOD VDDIO PGOODx VDDIO 4 INTB AGND EP VDDIO SDA TBBEN VDDIO XFAILB V1P5A RESETBMCU VDDIO PF5024 SW1IN VPRE SW2IN SW3IN SW4IN VDDOTP VDDIO PWRON STANDBY ENx WDI SCL VDDIO SYNC Figure 1. Simplified application diagram 4 Ordering information Table 1. Ordering information Package Type number [1] Name Description Version MPF5024AMBA0ES[2] MPF5024AMMA0ES[3] Plastic thermal enhanced very thin quad flat pack; no leads, wettable flank, 40 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body Temperature grade: 125 ℃ MPF5024AVNA0ES[4] HVQFN40 Plastic thermal enhanced very thin quad flat pack; no leads, wettable flank, 40 terminals, 0.5 mm pitch, 6 mm x 6 mm x 0.85 mm body Temperature grade: 105 ℃ SOT618-14 [1] To order parts in tape and reel, add the R2 suffix to the part number. [2] Automotive part, Safety grade: ASIL B [3] Automotive part, Safety grade: QM [4] Industrial part |
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