PCF8536AT datasheet(43/54 Pages) NXP

43 / 54 page

PCA85233

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Product data sheet

Rev. 5 — 12 November 2018

43 of 54

NXP Semiconductors

PCA85233

Automotive 80 × 4 LCD driver for low multiplex rates

[1]

For most applications SDA and SDAACK are shorted together; see Section 8.

[2]

The dummy pads are connected to VSS but are not tested.

[1]

Pressure of diamond head: 10 g to 50 g.

BP3

109

1228.05 436.5

LCD backplane output

BP1

110

1174.05 436.5

1932.03

436.5

[2] dummy pad

1909.53

436.5

1801.53

436.5

1693.53

436.5

1585.53

436.5

1477.53

436.5

1846.35 436.5

1953

436.5

1930.05 436.5

Table 25.

Gold bump hardness

Type number

Min

Max

Unit[1]

PCA85233UG/2DA/Q1

120

The approximate positions of the alignment marks are shown in Figure 27.

Fig 28. Alignment marks of PCA85233

Table 26.

Alignment mark locations

All x/y coordinates represent the position of the REF point (see Figure 28) with respect to the center

(x/y = 0) of the chip; see Figure 27.

Symbol

Size (

m)

X (

m)

Y (

m)

 81

1916.1

 81

1855.8

Table 24.

Bump locations of PCA85233UG

All x/y coordinates represent the position of the center of each bump with respect to the center

(x/y = 0) of the chip; see Figure 27.

Symbol

Bump

X (

m)

Y (

m)

Description

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