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TMS320F28069MPZPQ 数据表(PDF) 30 Page - Texas Instruments |
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TMS320F28069MPZPQ 数据表(HTML) 30 Page - Texas Instruments |
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30 / 181 page  30 TMS320F28069, TMS320F28069F, TMS320F28069M, TMS320F28068F, TMS320F28068M TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064 TMS320F28063, TMS320F28062, TMS320F28062F SPRS698H – NOVEMBER 2010 – REVISED MARCH 2020 www.ti.com Submit Documentation Feedback Product Folder Links: TMS320F28069 TMS320F28069F TMS320F28069M TMS320F28068F TMS320F28068M TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063 TMS320F28062 TMS320F28062F Specifications Copyright © 2010–2020, Texas Instruments Incorporated (1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements (2) lfm = linear feet per minute 5.7 Thermal Resistance Characteristics 5.7.1 PFP PowerPAD Package °C/W(1) AIR FLOW (lfm)(2) RΘJC Junction-to-case thermal resistance 9.4 0 RΘJB Junction-to-board thermal resistance 4.6 0 RΘJA (High k PCB) Junction-to-free air thermal resistance 25.8 0 16.3 150 15.2 250 13.6 500 PsiJT Junction-to-package top 0.3 0 0.4 150 0.4 250 0.5 500 PsiJB Junction-to-board 4.6 0 4.4 150 4.3 250 4.3 500 (1) These values are based on a JEDEC-defined 2S2P system (with the exception of the Theta JC [RΘJC] value, which is based on a JEDEC-defined 1S0P system) and will change based on environment as well as application. For more information, see these EIA/JEDEC standards: • JESD51-2, Integrated Circuits Thermal Test Method Environmental Conditions - Natural Convection (Still Air) • JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages • JESD51-9, Test Boards for Area Array Surface Mount Package Thermal Measurements (2) lfm = linear feet per minute 5.7.2 PZP PowerPAD Package °C/W(1) AIR FLOW (lfm)(2) RΘJC Junction-to-case thermal resistance 9.4 0 RΘJB Junction-to-board thermal resistance 4.4 0 RΘJA (High k PCB) Junction-to-free air thermal resistance 24.4 0 15.1 150 13.9 250 12.4 500 PsiJT Junction-to-package top 0.3 0 0.4 150 0.4 250 0.5 500 PsiJB Junction-to-board 4.5 0 4.2 150 4.2 250 4.2 500 |
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