TMS320F28069MPZPQ datasheet(12/181 Pages) TI

12 / 181 page

TMS320F28069, TMS320F28069F, TMS320F28069M, TMS320F28068F, TMS320F28068M

TMS320F28067, TMS320F28066, TMS320F28065, TMS320F28064

TMS320F28063, TMS320F28062, TMS320F28062F

SPRS698H – NOVEMBER 2010 – REVISED MARCH 2020

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Product Folder Links: TMS320F28069 TMS320F28069F TMS320F28069M TMS320F28068F TMS320F28068M

TMS320F28067 TMS320F28066 TMS320F28065 TMS320F28064 TMS320F28063 TMS320F28062

TMS320F28062F

Terminal Configuration and Functions

NOTE

The PowerPAD™ should be soldered to the ground (GND) plane of the PCB because this

will provide the best thermal conduction path. For this device, the PowerPAD is not

electrically shorted to the internal die VSS; therefore, the PowerPAD does not provide an

electrical connection to the PCB ground. To make optimum use of the thermal efficiencies

designed into the PowerPAD package, the PCB must be designed with this technology in

mind. A thermal land is required on the surface of the PCB directly underneath the body of

the PowerPAD. The thermal land should be soldered to the exposed lead frame die pad of

the PowerPad package; the thermal land should be as large as needed to dissipate the

required heat. An array of thermal vias should be used to connect the thermal pad to the

internal GND plane of the board. See PowerPAD™ Thermally Enhanced Package for more

details on using the PowerPAD package.

TMS320F28069MPZPQ 数据表(PDF) 12 Page - Texas Instruments