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ADP5075ACBZ-R7 数据表(PDF) 5 Page - Analog Devices |
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ADP5075ACBZ-R7 数据表(HTML) 5 Page - Analog Devices |
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5 / 19 page ![]() Data Sheet ADP5075 Rev. B | Page 5 of 19 ABSOLUTE MAXIMUM RATINGS Table 3. Parameter Rating PVIN, AVIN −0.3 V to +18 V SW PVIN − 40 V to PVIN + 0.3 V GND −0.3 V to +0.3 V VREG −0.3 V to lower of AVIN + 0.3 V or +6 V EN, FB, SYNC/FREQ −0.3 V to +6 V COMP, SLEW, SS, VREF −0.3 V to VREG + 0.3 V Operating Junction Temperature Range −40°C to +125°C Storage Temperature Range −65°C to +150°C Soldering Conditions JEDEC J-STD-020 Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. THERMAL RESISTANCE θJA is based on a 4-layer printed circuit board (PCB) (two signals and two power planes) as recommended in the Layout Considerations section. θJC is measured at the top of the package and is independent of the PCB. Table 4. Thermal Resistance Package Type θJA θJC Unit 12-Ball WLCSP 68.3 1.2 °C/W ESD CAUTION |
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