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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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ST25DV64K 数据表(PDF) 152 Page - STMicroelectronics |
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ST25DV64K 数据表(HTML) 152 Page - STMicroelectronics |
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152 / 200 page  10.3 UFDFN8 package information UFDFPN8 is an 8-lead, 2 × 3 mm, 0.5 mm pitch ultra thin profile fine pitch dual flat package. Figure 82. UFDFN8 - Outline Top view Pin #1 ID marking Side view Seating plane eee ccc C C C C C B A 1 2 N D E aaa aaa A A1 A3 2x 2x Datum A Terminal tip Detail “A” Even terminal L1 L3 L e e/2 Pin #1 ID marking Bottom view See Detail “A” e e 1 2 ND-1 x D2 L1 L3 E2 K L b 1. Max. package warpage is 0.05 mm. 2. Exposed copper is not systematic and can appear partially or totally according to the cross section. 3. Drawing is not to scale. Table 257. UFDFN8 - Mechanical data Symbol millimeters inches (1) Min Typ Max Min Typ Max A 0.450 0.550 0.600 0.0177 0.0217 0.0236 A1 0.000 0.020 0.050 0.0000 0.0008 0.0020 b (2) 0.200 0.250 0.300 0.0079 0.0098 0.0118 D 1.900 2.000 2.100 0.0748 0.0787 0.0827 D2 1.200 - 1.600 0.0472 - 0.0630 E 2.900 3.000 3.100 0.1142 0.1181 0.1220 E2 1.200 - 1.600 0.0472 - 0.0630 e - 0.500 - 0.0197 K 0.300 - - 0.0118 - - L 0.300 - 0.500 0.0118 - 0.0197 ST25DV04K ST25DV16K ST25DV64K UFDFN8 package information DS10925 - Rev 9 page 152/200 |
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