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数据搜索系统，热门电子元器件搜索 |
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数据搜索系统，热门电子元器件搜索 |
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ST25DV64K 数据表(PDF) 154 Page - STMicroelectronics |
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ST25DV64K 数据表(HTML) 154 Page - STMicroelectronics |
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154 / 200 page  Symbol millimeters inches (1) Min Typ Max Min Typ Max e 0.50 0.0197 E 2.95 3.00 3.10 0.1161 0.1181 0.1220 E2 2.50 2.55 2.60 0.0984 0.1004 0.1024 L 0.25 0.30 0.35 0.0098 0.0118 0.0138 k 0.40 0.0157 1. Values in inches are converted from mm and rounded to 4 decimal digits. 2. Package total thickness. 10.5 WLCSP10 package information Figure 84. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale package outline X A3 A2 A bbb Z e I H e1 D G DETAIL A Orientation reference Y E aaa (4X) SIDE VIEW BOTTOM VIEW TOP VIEW DETAIL A ROTATED 90 ccc M Z X Y dddM Z Z A1 b(10x) eee Z SEATING PLANE BUMP J F 1. Drawing is not to scale. 2. Dimension is measured at the maximum bump diameter parallel to primary datum Z. 3. Primary datum Z and seating plane are defined by the spherical crowns of the bump. 4. Bump position designation per JESD 95-1, SPP-010. Table 259. WLCSP - 10 balls, 1.649x1.483 mm, 0.4 mm pitch, wafer level chip scale mechanical data Symbol millimeters inches (1) Min Typ Max Min Typ Max A 0.265 0.295 0.325 0.0104 0.0116 0.0128 ST25DV04K ST25DV16K ST25DV64K WLCSP10 package information DS10925 - Rev 9 page 154/200 |
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