STM32F107VC datasheet(47/108 Pages) STMICROELECTRONICS

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STM32F105xx, STM32F107xx

Electrical characteristics

107

5.3.6

External clock source characteristics

High-speed external user clock generated from an external source

The characteristics given in Table 20 result from tests performed using an high-speed

external clock source, and under ambient temperature and supply voltage conditions

summarized in Table 9.

APB2 (up to 72 MHz)

APB2-Bridge

3.47

µA/MHz

GPIOA

6.39

GPIOB

6.39

GPIOC

6.11

GPIOD

6.39

GPIOE

6.11

SPI1

3.61

USART1

12.08

TIM1

23.47

ADC1(4)

18.21

1. The BusMatrix is automatically active when at least one master is ON.(CPU, ETH-MAC, DMA1 or DMA2).

2. When I2S is enabled we have a consumption add equal to 0, 02 mA.

3. When DAC_OUT1 or DAC_OUT2 is enabled we have a consumption add equal to 0, 3 mA.

4. Specific conditions for measuring ADC current consumption: fHCLK = 56 MHz, fAPB1 = fHCLK/2, fAPB2 =

fHCLK, fADCCLK = fAPB2/4. When ADON bit in the ADC_CR2 register is set to 1, a current consumption of

analog part equal to 0.6 mA must be added.

Table 19. Peripheral current consumption (continued)

Peripheral

Typical consumption at 25 °C

Unit

Table 20. High-speed external user clock characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

fHSE_ext

External user clock source

frequency(1)

MHz

VHSEH

OSC_IN input pin high level voltage

0.7VDD

VDD

VHSEL

OSC_IN input pin low level voltage

VSS

0.3VDD

tw(HSE)

OSC_IN high or low time(1)

1. Guaranteed by design, not tested in production.

tr(HSE)

tf(HSE)

OSC_IN rise or fall time(1)

Cin(HSE) OSC_IN input capacitance(1)

DuCy(HSE) Duty cycle

OSC_IN Input leakage current

VSS ≤VIN ≤VDD

±1

µA

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