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STM32F107VC 数据表(PDF) 91 Page - STMicroelectronics

部件名 STM32F107VC
功能描述  Connectivity line, ARM®-based 32-bit MCU with 64/256 KB Flash, USB OTG, Ethernet, 10 timers, 2 CANs, 2 ADCs, 14 communication interfaces
PDF  108 Pages
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制造商  STMICROELECTRONICS [STMicroelectronics]
网页  http://www.st.com
标志 STMICROELECTRONICS - STMicroelectronics

STM32F107VC 数据表(HTML) 91 Page - STMicroelectronics

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STM32F105xx, STM32F107xx
Package information
107
6.4
Thermal characteristics
The maximum chip junction temperature (TJmax) must never exceed the values given in
Table 9: General operating conditions on page 37.
The maximum chip-junction temperature, TJ max, in degrees Celsius, may be calculated
using the following equation:
TJ max = TA max + (PD max × ΘJA)
Where:
•
TA max is the maximum ambient temperature in ° C,
•ΘJA is the package junction-to-ambient thermal resistance, in ° C/W,
•
PD max is the sum of PINT max and PI/O max (PD max = PINT max + PI/Omax),
•
PINT max is the product of IDD and VDD, expressed in Watts. This is the maximum chip
internal power.
PI/O max represents the maximum power dissipation on output pins where:
PI/O max = Σ (VOL × IOL) + Σ((VDD – VOH) × IOH),
taking into account the actual VOL / IOL and VOH / IOH of the I/Os at low and high level in the
application.
6.4.1
Reference document
JESD51-2 Integrated Circuits Thermal Test Method Environment Conditions - Natural
Convection (Still Air). Available from www.jedec.org.
Table 61. Package thermal characteristics
Symbol
Parameter
Value
Unit
ΘJA
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
46
°C/W
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
45
ΘJA
Thermal resistance junction-ambient
LFBGA100 - 10 × 10 mm / 0.8 mm pitch
40
°C/W
Thermal resistance junction-ambient
LQFP100 - 14 × 14 mm / 0.5 mm pitch
46
Thermal resistance junction-ambient
LQFP64 - 10 × 10 mm / 0.5 mm pitch
45



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