STM32F107VC datasheet(107/108 Pages) STMICROELECTRONICS

107 / 108 page

DocID15274 Rev 10

107/108

STM32F105xx, STM32F107xx

Revision history

107

06-Mar-2015

Updated Table 40: LFBGA100 – 100-ball low profile fine pitch ball

grid array, 10 x 10 mm, 0.8 mm pitch, package mechanical data,

Table 59: LQPF100 - 100-pin, 14 x 14 mm low-profile quad flat

package mechanical data and Table 60: LQFP64 – 10 x 10 mm 64

pin low-profile quad flat package mechanical data

Updated Figure 14: High-speed external clock source AC timing

diagram; Figure 39: LFBGA100 - 10 x 10 mm low profile fine pitch

ball grid array package outline, Figure 43: LQFP100 – 14 x 14 mm

100 pin low-profile quad flat package outline, Figure 44: LQFP100 -

100-pin, 14 x 14 mm low-profile quad flat recommended footprint,

Figure 46: LQFP64 – 10 x 10 mm 64 pin low-profile quad flat

package outline and Figure 47: LQFP64 - 64-pin, 10 x 10 mm low-

profile quad flat recommended footprint

Added Figure 45: LQFP100 marking example (package top view),

Figure 48: LQFP64 marking example (package top view)

3-Sept-2015

Updated:

– Table 19: Peripheral current consumption

– Figure 44: LQFP100 - 100-pin, 14 x 14 mm low-profile quad flat

recommended footprint

– Table 58: LFBGA100 recommended PCB design rules (0.8 mm

pitch BGA)

22-Mar-2017

Updated:

– Table 5: Pin definitions

– Section 6: Package information

Added:

– Figure 42: LFBGA100 marking example (package top view)

Table 65. Document revision history (continued)

Date

Revision

Changes

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