M95256-DF datasheet(44/51 Pages) STMICROELECTRONICS

44 / 51 page

Date

Revision

Changes

Test conditions modified for ICC0 and ICC1, and VIH min modified in Table 17: AC characteristics (M95256, device

grade 3).

tW modified and “preliminary data” note removed in Table 20: AC characteristics (M95256-DR, M95256-R device

grade 6).

Blank option removed below Plating technology, process A modified and process V removed in Table 25: Ordering

information scheme.

Table 26: Available M95256x products (package, voltage range, temperature grade) added.

SO8N and SO8W package specifications updated (see Section 10: Package mechanical data). Package

mechanical data: inches calculated from mm and rounded to 3 decimal digits.

27-Mar-2008

Section 3.8: Operating supply voltage (VCC) modified. Small text changes. Frequency corrected on page 1.

VIL and VIH modified in Table 16: DC characteristics (M95256-R, M95256-DR, device grade 6).

AB Process added to Table 25: Ordering information scheme.

15-Jul-2008

WLCSP package added (see Figure 3: WLCSP connections (top view, marking side, with balls on the underside)

and Section 10: Package mechanical data).

24-Jun-2010

Updated Section 3.8: Operating supply voltage (VCC)

Updated Section 4.3: Data protection and protocol control

Updated Section 5.4: Write Status Register (WRSR)

Added note in Section 5.6: Write to Memory Array (WRITE)

Updated Table 7: Absolute maximum ratings

Added Table 20: AC characteristics (M95256-DR, M95256-R device grade 6)

Updated Table 20: AC characteristics (M95256-DR, M95256-R device grade 6)

07-Sep-2010

Updated Section 1: Description.

Updated Section 5.7: Read Identification Page (available only in M95256-DR devices).

Updated Section 5.8: Write Identification Page.

Updated Section 5.9: Read Lock Status (available only in M95256-DR devices).

12-Nov-2010

Updated Features.

Updated Section 5.8: Write Identification Page.

Added Figure 25: TSSOP8 – 8 lead thin shrink small outline, package outline.

Added Table 23: UFDFPN8 (MLP8) – 8-lead ultra thin fine pitch dual flat package no lead 2 × 3 mm, package

mechanical data.

Updated Section 11: Part numbering.

Updated Table 26: Available M95256x products (package, voltage range, temperature grade).

Updated Figure 25, Figure 26.

22-Mar-2011

Deleted:

•

SO8 (MW) picture under Features

•

SO8 (MW) mechanical dimensions

Updated:

•

UFDFPN8 (MB) with UFDFPN8 (MB, MC) picture under Features

•

Section 5.6.1: ECC (error correction code) and Write cycling

•

Section 7: Connecting to the SPI bus

•

Table 7: Absolute maximum ratings

Process letter K substituted with only concerned products (M95256-D and M95256 in MLP8 package MC).9

M95256-W M95256-R M95256-DF

DS4712 - Rev 22

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