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M95256-DF 数据表(PDF) 45 Page - STMicroelectronics |
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M95256-DF 数据表(HTML) 45 Page - STMicroelectronics |
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45 / 51 page  Date Revision Changes Rephrased “test condition” text in: • Table 14: DC characteristics (M95256, device grade 3) • Table 20: DC characteristics (current M95080-W products) • Table 16: DC characteristics (M95256-W, device grade 3) • Table 23: DC characteristics (current and new M95080-R and M95080-DR products) • Table 18: AC characteristics (M95256, device grade 3) • Table 31: AC characteristics, M95080-W, device grade 6 • table 20: AC characteristics (M95256-W, device grade 3) • Table 36: AC characteristics (M95080-R, M95080-DR device grade 6) Added: • Caution under Figure 3: WLCSP connections (top view, marking side, with balls on the underside) • MC = UFDFPN8 package in Section 11: Part numbering 20-May-2011 14 Updated: • UFDFPN8 offered in only one package version Added: • Table 15: Memory cell characteristics 19-Jul-2011 15 MC package added (UFDFPN8) 23-Nov-2011 16 Updated: • Footnote 3 below Table 7: Absolute maximum ratings • Footnotes 1, 2, 4, 5 below Table 15: DC characteristics (M95256-W, device grade 6) • Footnotes 1, 2, 3, 5 below Table 17: DC characteristics (M95256-R, M95256-DR, device grade 6) • Table 19: AC characteristics, M95256-W, device grade 6 headings, TQLQH and TQHQL values. One footnote removed and one added • Table 21: AC characteristics (M95256-DR, M95256-R device grade 6), new columns for new pairs of products. Footnote 2 edited. 17-Jan-2012 17 Updated Figure 25: UFDFPN8 (MLP8) - 8-lead ultra thin fine pitch dual flat no lead, package outline. 21-Jun-2012 18 Datasheet split into: • M95256-125 datasheet for automotive products (range 3) • M95256-W, M95256-R, M95256-DR, M95256-DF (this datasheet) for standard products (range 6). Added: • 1.7 V device (M95256-DF) Updated: • Figure 15: Block diagram • Table 58: M95080-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package mechanical data and Figure 42: M95080-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline • Cycling and data retention values (Table 19 and Table 20) Deleted: • UFDFPN8 package rev MB 24-Jul-2012 19 Updated: • WLCSP package reference from “CT” to “CS” • Figure 3: WLCSP connections (top view, marking side, with bumps on the underside) • Figure 42: M95080-DFCS6TP/K, WLCSP 8-bump wafer-level chip scale package outline. 09-Apr-2013 20 Document reformatted. Updated: • Package figure on cover page • Section 7.2: Initial delivery state • Note (1) in Table 7: Absolute maximum ratings Deleted former footnote 1 in Table 17: DC characteristics (M95256-DF, device grade 6). Replaced “ball” by “bump” in the entire document. M95256-W M95256-R M95256-DF DS4712 - Rev 22 page 45/51 |
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