ST7FL15F1MATRE datasheet(111/138 Pages) STMICROELECTRONICS

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ELECTRICAL CHARACTERISTICS (cont’d)

13.7 EMC CHARACTERISTICS

Susceptibility tests are performed on a sample ba-

sis during product characterization.

13.7.1

Functional

EMS

(Electro

Magnetic

Susceptibility)

Based on a simple running application on the

product (toggling two LEDs through I/O ports), the

product is stressed by two electro magnetic events

until a failure occurs (indicated by the LEDs).

■ ESD: Electro-Static Discharge (positive and

negative) is applied on all pins of the device until

a functional disturbance occurs. This test

conforms with the IEC 1000-4-2 standard.

■ FTB: A Burst of Fast Transient voltage (positive

and negative) is applied to VDD and VSS through

a 100pF capacitor, until a functional disturbance

occurs. This test conforms with the IEC 1000-4-

4 standard.

A device reset allows normal operations to

resume. The test results are given in the table be-

low based on the EMS levels and classes defined

in application note AN1709.

13.7.1.1 Designing Hardened Software to Avoid

Noise Problems

EMC characterization and optimization are per-

formed at component level with a typical applica-

tion environment and simplified MCU software. It

should be noted that good EMC performance is

highly dependent on the user application and the

software in particular.

Therefore, it is recommended that EMC software

optimization and prequalification tests are made

relative to the EMC level requested for the user's

application.

Software recommendations:

The software flowchart must include the manage-

ment of runaway conditions such as:

– Corrupted program counter

– Unexpected reset

– Critical data corruption (control registers...)

Prequalification trials:

Most of the common failures (unexpected reset

and program counter corruption) can be repro-

duced by manually forcing a low state on the RE-

SET pin or the Oscillator pins for 1 second.

To complete these trials, ESD stress can be ap-

plied directly on the device, over the range of

specification values. When unexpected behavior

is detected, the software can be hardened to pre-

vent unrecoverable errors occurring (see applica-

tion note AN1015).

13.7.2 Electro Magnetic Interference (EMI)

Based on a simple application running on the

product (toggling two LEDs through the I/O ports),

the product is monitored in terms of emission. This

emission test is in line with the norm SAE J 1752/

3 which specifies the board and the loading of

each pin.

Notes:

1. Data based on characterization results, not tested in production.

Symbol

Parameter

Conditions

Level/

Class

VFESD

Voltage limits to be applied on any I/O pin to induce a function-

al disturbance

VDD = 5V, TA = 25°C, fOSC = 8MHz,

conforms to IEC 1000-4-2

VFFTB

Fast transient voltage burst limits to be applied through 100pF

on VDD and VDD pins to induce a functional disturbance

VDD = 5V, TA = 25°C, fOSC = 8MHz,

conforms to IEC 1000-4-4

Symbol

Parameter

Conditions

Monitored

Frequency Band

Max vs [fOSC/fCPU]Unit

8/4 MHz

16/8 MHz

SEMI

Peak level1)

VDD = 5V, TA = 25°C,

SO20 package,

conforming to SAE J 1752/3

0.1 MHz to 30 MHz

dBµV

30 MHz to 130 MHz

130 MHz to 1 GHz

SAE EMI Level

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