LTM4659EVPBF datasheet(18/26 Pages) AD

18 / 26 page

LTM4659

Rev. 0

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value, which is very close. Table 6 and Table 7 provide

equivalent thermal resistances for 1.5V and 2.5V outputs

with and without airflow. The Pin Configuration section

shows the simulation data for the worst-case scenario.

Table 5 to Table 7 provide equivalent thermal resistances

for 1.0V, 1.5V and 2.5V outputs with and without airflow.

The derived thermal resistances in Table 5 to Table 7 for

the various conditions can be multiplied by the calculated

power loss as a function of ambient temperature to derive

APPLICATIONS INFORMATION

Table 5. 1.0V Output

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIRFLOW (LFM)

HEAT SINK

θJA (°C/W)

Figure 9, Figure 12

3.3, 5

Figure 7, Figure 8

None

Figure 9, Figure 12

3.3, 5

Figure 7, Figure 8

200

None

Figure 9, Figure 12

3.3, 5

Figure 7, Figure 8

400

None

Table 6. 1.5V Output

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIRFLOW (LFM)

HEAT SINK

θJA (°C/W)

Figure 10, Figure 13

3.3, 5

Figure 7, Figure 8

None

Figure 10, Figure 13

3.3, 5

Figure 7, Figure 8

200

None

Figure 10, Figure 13

3.3, 5

Figure 7, Figure 8

400

None

Table 7. 2.5V Output

DERATING CURVE

VIN (V)

POWER LOSS CURVE

AIRFLOW (LFM)

HEAT SINK

θJA (°C/W)

Figure 11, Figure 14

3.3, 5

Figure 7, Figure 8

None

Figure 11, Figure 14

3.3, 5

Figure 7, Figure 8

200

None

Figure 11, Figure 14

3.3, 5

Figure 7, Figure 8

400

None

temperature rise above ambient, thus maximum junction

temperature.Roomtemperaturepowerlosscanbederived

from the efficiency curves in the Typical Performance

Characteristics section and adjusted with the above

ambient temperature multiplicative factors. The printed

circuit board is a 1.6mm thick four-layer board with two

ounces of copper for the two outer layers and one ounce

copper for the two inner layers. The PCB dimensions are

76mm × 76mm.

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