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LP3950SL 数据表(PDF) 2 Page - National Semiconductor (TI) |
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LP3950SL 数据表(HTML) 2 Page - National Semiconductor (TI) |
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2 / 31 page ![]() Connection Diagrams and Package Mark Information 32-Lead Thin CSP Package, 4.5 x 5.5 x 0.8 mm, 0.5 mm Pitch See NS Package Number SLD32A 20129302 Top View 20129303 Bottom View 20129304 Note: The actual physical placement of the package marking will vary from part to part. The package marking “XY” designates the date code. “UZ” and “TT” are NSC internal codes for die manufacturing and assembly traceability. Both will vary considerably. Package Mark — Top View Ordering Information Order Number Package Marking Supplied As LP3950SL LP3950SL 1000 units, Tape-and-Reel LP3950SLX LP3950SL 2500 units, Tape-and-Reel www.national.com 2 |
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