ADS7253 datasheet(5/73 Pages) TI2

5 / 73 page

ADS8354, ADS7854, ADS7254

www.ti.com

SBAS556B – OCTOBER 2013 – REVISED AUGUST 2014

7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating free-air temperature range (unless otherwise noted)

MIN

MAX

UNIT

AVDD to REFGND_x or DVDD to GND

–0.3

Analog (AINP_x and AINM_x) and reference input (REFIO_x) voltage with

REFGND_x – 0.3

AVDD + 0.3

respect to REFGND_x

Digital input voltage with respect to GND

GND – 0.3

DVDD + 0.3

Ground voltage difference |REFGND_x-GND|

0.3

Input current to any pin except supply pins

±10

Maximum virtual junction temperature, TJ

150

°C

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7.2 Handling Ratings

MIN

MAX

UNIT

Tstg

Storage temperature range

–65

150

°C

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

–2000

2000

pins(1)

V(ESD)

Electrostatic discharge

Charged device model (CDM), per JEDEC specification

–500

500

JESD22-C101, all pins(2)

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

AVDD

Analog supply voltage

DVDD

Digital supply voltage

3.3

7.4 Thermal Information

ADS8354, ADS7854, ADS7254

THERMAL METRIC(1)

RTE (WQFN)

PW (TSSOP)

UNIT

16 PINS

RθJA

Junction-to-ambient thermal resistance

33.3

86.9

RθJC(top)

Junction-to-case (top) thermal resistance

29.5

RθJB

Junction-to-board thermal resistance

7.3

39.1

°C/W

ψJT

Junction-to-top characterization parameter

0.2

0.8

ψJB

Junction-to-board characterization parameter

7.4

38.4

RθJC(bot)

Junction-to-case (bottom) thermal resistance

0.9

N/A

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

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