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STM32F427AI 数据表(PDF) 202 Page - STMicroelectronics |
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STM32F427AI 数据表(HTML) 202 Page - STMicroelectronics |
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202 / 240 page ![]() Package information STM32F427xx STM32F429xx 202/240 DS9405 Rev 12 7.3 WLCSP143 package information Figure 80. WLCSP143 - 143-ball, 4.521x 5.547 mm, 0.4 mm pitch wafer level chip scale package outline 1. Drawing is not to scale. Table 112. WLCSP143 - 143-ball, 4.521x 5.547 mm, 0.4 mm pitch wafer level chip scale package mechanical data Symbol millimeters inches(1) Min Typ Max Min Typ Max A 0.525 0.555 0.585 0.0207 0.0219 0.0230 A1 - 0.175 - - 0.0069 - A2 - 0.380 - - 0.0150 - A0WE_ME_V2 e1 F G e e Bottom view Bump side e2 A1 ball location D A1 orientation reference Top view Wafer back side Detail A A3 A2 Side view A E Detail A Rotated 90° Bump Seating plane b A1 A3 aaa ccc ddd Z Z X Y bbb eee |
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