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STM32F427AI 数据表(PDF) 204 Page - STMicroelectronics |
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STM32F427AI 数据表(HTML) 204 Page - STMicroelectronics |
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204 / 240 page  Package information STM32F427xx STM32F429xx 204/240 DS9405 Rev 12 7.3.1 Device marking for WLCSP143 The following figure gives an example of topside marking orientation versus ball A 1 identifier location. Other optional marking or inset/upset marks, which depend on assembly location, are not indicated below. Figure 82. WLCSP143 marking example (package top view) Table 113. WLCSP143 recommended PCB design rules Dimension Recommended values Pitch 0.4 Dpad 0.225 mm Dsm 0.290 mm typ. (depends on the soldermask registration tolerance) Stencil opening 0.250 mm Stencil thickness 0.100 mm MSv37234V3 Date code = Year+Week ball A1 Product identification(1) Y WW Revision code |
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