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M50FW080 数据表(PDF) 48 Page - STMicroelectronics |
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M50FW080 数据表(HTML) 48 Page - STMicroelectronics |
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48 / 56 page ![]() Part numbering M50FW080 48/55 11 Part numbering Devices are shipped from the factory with the memory content bits erased to ’1’. For a list of available options (Speed, Package, etc.) or for further information on any aspect of this device, please contact the ST Sales Office nearest to you. The category of second-Level Interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. Table 29. Ordering information scheme Example: M50FW080 N 5 T G Device Type M50 = Flash Memory for PC BIOS Architecture F = Firmware Hub Interface Operating Voltage W = VCC = 3.0 to 3.6V Device Function 080 = 8 Mbit (1Mbx8), Uniform Blocks Package K = PLCC32 NB = TSOP32: 8 x 14mm(1) 1. Devices sold in this package are Not Recommended for New Design. N = TSOP40: 10 x 20mm Device Grade 5 = Temperature range –20 to 85 °C. Device tested with standard test flow Option blank = Standard Packing T = Tape and Reel Packing Plating Technology P or G = ECOPACK® (RoHs compliant) |
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