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M50FW080 数据表(PDF) 55 Page - STMicroelectronics |
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M50FW080 数据表(HTML) 55 Page - STMicroelectronics |
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55 / 56 page ![]() M50FW080 Revision history 55/55 12 Revision history Table 30. Document revision history Date Version Changes April 2001 -01 First Issue 18-May-2001 -02 Document type: from Product Preview to Preliminary Data 22-Jun-2001 -03 PLCC32 package added 6-Jul-2001 -04 Note 2 changed (Table 15, Absolute Maximum Ratings) 30-Jan-2002 -05 Document promoted from Preliminary Data to Full Data Sheet 01-Mar-2002 -06 RFU pins must be left disconnected 12-Mar-2002 -07 Specification of PLCC32 package mechanical data revised 19-May-2004 8.0 TSOP32 package added. Part numbering information updated. Flow- chart illustrations, in Appendix, updated. Document reformatted 19-Aug-2004 9.0 Pins 2 and 5 of the TSOP32 Connections illustration corrected 24-Oct-2006 10 Document converted to new ST template. Small text changes. Device Grade 1 removed. Packages are ECOPACK® compliant. TLEAD removed from Table 15: Absolute maximum ratings. Blank option removed from below Plating Technology in Table 29: Ordering information scheme. |
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