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ST7LITE1XB 数据表(PDF) 146 Page - STMicroelectronics |
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ST7LITE1XB 数据表(HTML) 146 Page - STMicroelectronics |
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146 / 157 page  ST7LITE1xB 146/157 Table 24. THERMAL CHARACTERISTICS Notes: 1. The maximum chip-junction temperature is based on technology characteristics. 2. The maximum power dissipation is obtained from the formula PD = (TJ -TA) / RthJA. The power dissipation of an application can be defined by the user with the formula: PD=PINT+PPORT where PINT is the chip internal power (IDDxVDD) and PPORT is the port power dissipation depending on the ports used in the application. Symbol Ratings Value Unit RthJA Package thermal resistance (junction to ambient) DIP16/SO16 85 °C/W DIP20/SO20 85 QFN20 (on 4-layer PCB) QFN20 (on 2-layer PCB) 43 95 TJmax Maximum junction temperature 1) 150 °C PDmax Power dissipation 2) DIP16/SO16 300 mW DIP20/SO20 300 |
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