www.ams.com

AS89020

V3.01

FEATURES ..................................................................................................................................1

APPLICATIONS ..........................................................................................................................1

TYPICAL MARKETS.....................................................................................................................1

1

GENERAL DESCRIPTION ......................................................................................................3

2

ELECTRICAL CHARACTERISTICS..........................................................................................4

2.1

Absolute Maximum Ratings ........................................................................................ 4

2.2

Recommended Operating Conditions ........................................................................... 4

2.3

Electrical Characteristics ............................................................................................ 6

3

BLOCK DIAGRAM .................................................................................................................9

4

PIN ASSIGNMENT..............................................................................................................10

5

DESCRIPTION OF FUNCTION .............................................................................................11

5.1

Description............................................................................................................. 11

5.2

Operational States .................................................................................................. 11

5.3

Power Down Mode................................................................................................... 11

5.4

AD Converter.......................................................................................................... 12

5.5

AD Conversion........................................................................................................ 12

5.6

Input amplifier........................................................................................................ 14

5.7

Temperature Compensation ..................................................................................... 15

5.8

SPI – Interface & Communication.............................................................................. 15

6

DESCRIPTION OF REGISTERS............................................................................................17

6.1

Control Register Bank .............................................................................................. 17

6.2

Operational State Register – OSR.............................................................................. 18

6.3

API Generation Register – AGEN ............................................................................... 19

6.4

Configuration Register – CREG.................................................................................. 19

6.5

Transimpedance Register – SW_RX ........................................................................... 20

6.6

Channel Power Down Register – CH_PD ..................................................................... 21

6.7

Channel Order Register – CH_ORDER ........................................................................ 22

6.8

Channel Output Data Format .................................................................................... 22

7

EXAMPLES OF COMMUNICATION VIA SPI..........................................................................23

8

PACKAGE...........................................................................................................................24

8.1

Shape and Dimensions ............................................................................................ 24

8.2

PIN CONFIGURATION .............................................................................................. 25

8.3

Packing Information ................................................................................................ 25

8.4

Soldering Information.............................................................................................. 25

9

APPLICATION NOTES ........................................................................................................26

10 NOTES FOR PCB LAYOUT ...................................................................................................27

ORDERING INFORMATION .......................................................................................................28

LEGAL NOTES AND WARNINGS ................................................................................................29