MMBZXVAL_SER_1

© NXP B.V. 2008. All rights reserved.

Product data sheet

Rev. 01 — 1 September 2008

10 of 15

NXP Semiconductors

MMBZxVAL series

Double ESD protection diodes for transient overvoltage suppression

Circuit board layout and protection device placement

Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)

and surge transients. The following guidelines are recommended:

1. Place the devices as close to the input terminal or connector as possible.

2. The path length between the device and the protected line should be minimized.

3. Keep parallel signal paths to a minimum.

4. Avoid running protected conductors in parallel with unprotected conductors.

5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and

ground loops.

6. Minimize the length of the transient return path to ground.

7. Avoid using shared transient return paths to a common ground point.

8. Ground planes should be used whenever possible. For multilayer PCBs, use ground

vias.

9.

Test information

9.1 Quality information

This product has been qualified in accordance with the Automotive Electronics Council

(AEC) standard

Q101 - Stress test qualification for discrete semiconductors, and is

suitable for use in automotive applications.

10. Package outline

Fig 10. Package outline SOT23 (TO-236AB)

04-11-04

Dimensions in mm

0.45

0.15

1.9

1.1

0.9

3.0

2.8

2.5

2.1

1.4

1.2

0.48

0.38

0.15

0.09

12

3