AD8363ACPZ-R7 datasheet(33/36 Pages) AD

33 / 36 page

AD8363

Rev. 0 | Page 33 of 36

OUTLINE DIMENSIONS

1.95 BSC

PIN 1

INDICATOR

TOP

VIEW

4.00

BSC SQ

3.75

BSC SQ

COPLANARITY

0.08

EXPOSED

PAD

(BOTTOM VIEW)

COMPLIANT TO JEDEC STANDARDS MO-220-VGGC

12° MAX

1.00

0.85

0.80

SEATING

PLANE

0.35

0.30

0.25

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

0.20 REF

0.65 BSC

0.60 MAX

PIN 1

INDICATOR

0.50

0.40

0.30

0.25 MIN

2.50

2.35 SQ

2.20

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 74. 16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4mm Body, Very Thin Quad

(CP-16-10)

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

Ordering Quantity

AD8363ACPZ-R71

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-10

1,500

AD8363ACPZ-WP1

−40°C to +125°C

16-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

CP-16-10

AD8363-EVALZ1

Evaluation Board

1 Z = RoHS Compliant Part.

AD8363ACPZ-R7 数据表(PDF) 33 Page - Analog Devices

AD8363ACPZ-R7 数据表(HTML) 33 Page - Analog Devices

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36

数据表下载