ADCLK846

Rev. A | Page 6 of 16

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

2 V

Inputs

CLK and CLK

−0.3 V to +2 V

CMOS Inputs

−0.3 V to +2 V

Outputs

Maximum Voltage

−0.3 V to +2 V

−0.3 V to +2 V

Operating Temperature Range

Ambient

−40°C to +85°C

Junction

150°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

DETERMINING JUNCTION TEMPERATURE

To determine the junction temperature on the application PCB,

use the following formula:

where:

top center of the package.

PD is the power dissipation.

design considerations.

ESD CAUTION

THERMAL PERFORMANCE

Table 6.

Parameter

Symbol

Description

Value1

Unit

Junction-to-Ambient Thermal Resistance

θ

JA

Still Air

Per JEDEC JESD51-2

0.0 m/sec Airflow

57.0

°C/W

Moving Air

θ

JMA

Per JEDEC JESD51-6

1.0 m/sec Airflow

49.8

°C/W

2.5 m/sec Airflow

44.7

°C/W

Junction-to-Board Thermal Resistance

θ

JB

Moving Air

Per JEDEC JESD51-8

1.0 m/sec Airflow

35.2

°C/W

Junction-to-Case Thermal Resistance

θ

JC

Moving Air

Per MIL-STD 883, Method 1012.1

Die-to-Heat Sink

2.0

°C/W

Junction-to-Top-of-Package Characterization Parameter

Still Air

Per JEDEC JESD51-2

0 m/sec Airflow

1.0

°C/W

application to determine if they are similar to those assumed in these calculations.