ADCLK846

Rev. A | Page 15 of 16

*COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-2

EXCEPT FOR EXPOSED PAD DIMENSION

OUTLINE DIMENSIONS

1

24

6

7

13

19

18

12

*2.45

2.30 SQ

2.15

0.60 MAX

0.50

0.40

0.30

0.30

0.23

0.18

2.50 REF

0.50

BSC

12° MAX

0.80 MAX

0.65 TYP

0.05 MAX

0.02 NOM

1.00

0.85

0.80

SEATING

PLANE

PIN 1

INDICATOR

TOP

VIEW

3.75

BSC SQ

4.00

BSC SQ

PIN 1

INDICATOR

0.60 MAX

COPLANARITY

0.08

0.20 REF

0.23 MIN

EXPOSED

PAD

(BOTTOMVIEW)

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Figure 33. 24-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

4 mm × 4 mm Body, Very Thin Quad

CP-24-2

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADCLK846BCPZ1

−40°C to +85°C

24-Lead LFCSP_VQ

CP-24-2

ADCLK846BCPZ-REEL71

−40°C to +85°C

24-Lead LFCSP_VQ

CP-24-2

ADCLK846/PCBZ1

Evaluation Board