ADCLK854

Rev. 0 | Page 6 of 16

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

Supply Voltage

2 V

Inputs

CLKx and CLKx

−0.3 V to +2 V

CMOS Inputs

−0.3 V to +2 V

Outputs

Maximum Voltage

−0.3 V to +2 V

−0.3 to +2 V

Operating Temperature

Ambient Range

−40°C to +85°C

Junction

150°C

Storage Temperature Range

−65°C to +150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

DETERMINING JUNCTION TEMPERATURE

To determine the junction temperature on the application

printed circuit board (PCB), use the following equation:

where:

is the junction temperature (°C).

is the case temperature (°C) measured by the user at the

top center of the package.

Ψ

JT

is from Table 6.

is the power dissipation.

and PCB design considerations.

ESD CAUTION

THERMAL PERFORMANCE

Table 6.

Parameter

Symbol

Description (Using a 2S2P Test Board)

Value 1

Unit

Junction-to-Ambient Thermal Resistance

θ

JA

Still Air

Per JEDEC JESD51-2

0.0 m/sec Air Flow

42

°C/W

Moving Air

θ

JMA

Per JEDEC JESD51-6

1.0 m/sec Air Flow

37

°C/W

2.5 m/sec Air Flow

33

°C/W

Junction-to-Board Thermal Resistance

θ

JB

Moving Air

Per JEDEC JESD51-8

1.0 m/sec Air Flow

26

°C/W

Junction-to-Case Thermal Resistance

θ

JC

Moving Air

Per MIL-STD 883, Method 1012.1

Die-to-Heat Sink

2

°C/W

Junction-to-Top-of-Package Characterization Parameter

Ψ

JT

Still Air

Per JEDEC JESD51-2

0 m/sec Air Flow

0.5

°C/W

application to determine if they are similar to those assumed in these calculations.