ADCLK854

Rev. 0 | Page 16 of 16

*COMPLIANT TO JEDEC STANDARDS MO-220-VKKD-2

WITH EXCEPTION TO EXPOSED PAD DIMENSION.

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

OUTLINE DIMENSIONS

6.75

BSC SQ

7.00

BSC SQ

0.30

0.23

0.18

1

48

12

13

37

36

24

25

*2.90

2.80 SQ

2.70

0.50

0.40

0.30

0.80 MAX

0.65 TYP

5.50 REF

COPLANARITY

0.08

0.20 MIN

EXPOSED

PAD

(BOTTOM VIEW)

0.20 REF

1.00

0.85

0.80

0.05 MAX

0.02 NOM

SEATING

PLANE

12° MAX

TOP VIEW

0.60 MAX

0.60 MAX

PIN 1

INDICATOR

PIN 1

INDICATOR

0.50

BSC

Figure 33. 48-Lead Lead Frame Chip Scale Package [LFCSP_VQ]

7 mm × 7 mm Body, Very Thin Quad

CP-48-6

Dimensions shown in millimeters

ORDERING GUIDE

Model

Temperature Range

Package Description

Package Option

ADCLK854BCPZ 1

−40°C to +85°C

48-Lead LFCSP_VQ

CP-48-6

ADCLK854BCPZ-REEL71

−40°C to +85°C

48-Lead LFCSP_VQ

CP-48-6

ADCLK854/PCBZ1

Evaluation Board

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Devices, Inc. All rights reserved.

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registered trademarks are the property of their respective owners.

D07218-0-4/09(0)